Domestic Precision Maker Breaks Through, Supplies Ultra-Tight Tolerance SUS304 Parts to ASML

Shenzhen KGL Electromechanical’s 26-year expertise delivers 0.01mm-precision stainless steel components for EUV lithography equipment

By Industry Correspondent

SHENZHEN – The global semiconductor equipment landscape is witnessing a new milestone in domestic high-end precision manufacturing, as Shenzhen KGL Electromechanical Co., Ltd. has secured a position in ASML's elite global supply chain, producing ultra-precise SUS304 stainless steel structural parts with a strict 0.01-millimeter tolerance for the firm’s advanced semiconductor production hardware.

Market data underscores the critical value of precision component suppliers. In 2025, the worldwide semiconductor equipment market hit $133 billion, with ASML alone posting $37.2 billion in annual revenue. Every extreme ultraviolet (EUV) lithography machine relies on an intricate network of specialized precision machined parts, a sector long dominated by veteran international manufacturers. Now, Shenzhen KGL, boasting 26 years of focused precision machining experience, has emerged as a qualified domestic supplier capable of meeting the lithography giant’s most stringent technical benchmarks.

Unprecedented Machining Specifications Pose Severe Technical Hurdles

The custom component ordered by ASML represents one of the most rigorous manufacturing tests in precision engineering, with full design specifications outlined in the table below:

Manufacturing teams face three inherent drawbacks of SUS304 austenitic stainless steel that complicate high-precision thin-plate processing. First, the material is prone to severe work hardening during cutting operations, accelerating tool wear. Research published in China Mechanical Engineering in 2024 by Professor Zhan Lihua's research team at Central South University confirmed the alloy’s obvious strain-rate strengthening property: its yield strength rises from 280 MPa at a strain rate of 0.00067 s⁻¹ to 370 MPa at 1.0 s⁻¹.

Second, SUS304 carries a thermal conductivity of merely 15 W/(m·K), roughly one-third that of carbon steel. Cutting heat accumulates intensely on machining surfaces, triggering thermal deformation ranging from 0.02 mm to 0.05 mm on the 0.3 mm ultra-thin walls. Third, the Olson-Cohen kinetic model explains that true strain exceeding 0.27 triggers strain-induced martensitic transformation, which brings secondary hardening and further impairs machinability.

Customized Five-Stage Process Resolves Core Production Bottlenecks

To overcome these material and structural challenges, KGL R&D team rolled out a proprietary five-stage manufacturing workflow: rough machining → 24-hour natural aging under a constant temperature of 20±0.5℃ → semi-finishing → thermal cycling stress relief (-40℃ to +80℃) → precision finishing.

Engineers also calibrated targeted cutting parameters for each production phase, paired with matched cooling solutions as detailed in the table:

Another core innovation lies in a composite fixture integrating 40–60 kPa vacuum adsorption and auxiliary supports. After 12 rounds of iterative optimization, clamping deformation was slashed from 0.015 mm to below 0.003 mm. For the ultra-fine Φ0.1 mm micro-holes, technicians adopted a three-step drilling routine consisting of center drilling, hole expansion and reaming, combined with peck drilling cycles and high-pressure coolant above 70 bar to fully evacuate metal chips.

Mass Production Delivers Stable, Superior Quality Metrics

Rigorous batch testing verifies that all finished parts outperform ASML's official technical requirements, with consistent production stability reflected in the quality inspection table:

Every key geometric indicator beats the 0.01 mm tolerance threshold, with all CPK process capability values surpassing 1.47, a benchmark for reliable mass manufacturing. The company maintains a 99.8% finished product yield across continuous production batches.

Surging Domestic Precision Machining Demand Drives Localization Progress

China's precision machining industry posted a market size of RMB 487.2 billion in 2025, representing a 7.3% year-on-year growth. Within the sector, semiconductor equipment manufacturers spent RMB 38.7 billion on precision component procurement alone. Industry statistics show the domestic localization rate of core semiconductor manufacturing equipment climbed from 35% to 42% last year, fueling robust demand for capable local precision processing enterprises.

Hu Qiaosheng, General Manager of Shenzhen KGL Electromechanical, leads the firm's technical innovation team. Holding a bachelor’s degree in Mechanical Engineering and a PhD from NLBA Business School in the Netherlands, Hu has accumulated 26 years of hands-on experience in precision machining. Under his leadership, the enterprise provides customized high-precision manufacturing solutions for global clients spanning semiconductors, medical devices and aerospace.

Hu noted that KGL entry into ASML's supply chain marks a critical breakthrough for China's domestic ultra-precision processing capacity. “Our success proves local manufacturers can meet the most demanding international standards for semiconductor core parts. Moving forward, we will keep upgrading our process technology to support the broader localization of China's semiconductor equipment industry,” he said.